Name: chladič CPU - ALUCIA H6LS
Brand: Akasa
SKU: 67418454
Price: 67.9 CHF
Availability: InStock

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The Akasa ALUCIA H6LS M2 is a low-profile CPU cooler designed for compact systems that require efficient heat management with limited height. Featuring a black slim fan and six heat pipes, this cooler maintains a height of just 67.2 mm while providing reliable cooling performance. The six-heat-pipe design efficiently transfers heat from the processor to the aluminum fins, where the 120 mm slim fan dissipates it with minimal noise. Made from durable materials, the cooler supports various CPU sockets and is compatible with most modern processors. Its black surface offers a neutral appearance suitable for different system configurations. The flat design makes it ideal for small form factor cases, HTPCs, and systems with limited space. Installation is straightforward with the included mounting hardware for multiple platforms. The fan operates at variable speeds, balancing cooling efficiency and acoustic performance. This cooler presents a practical solution for users seeking reliable heat management in space-constrained environments without compromising on build quality or functionality.

Actual product image Akasa chladič CPU - ALUCIA H6LS (67.20 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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