Name: ALUCIA H6LS M2 CPU cooler - 120 mm, black / blue
Brand: Akasa
SKU: 47807799
Price: 62.95 CHF
Availability: InStock

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Akasa

The ALUCIA H6LS M2 CPU cooler from Akasa is a powerful cooling solution specifically designed for efficient heat dissipation from processors. With a compact design and a height of just 67.2 mm, this cooler is ideal for systems with limited space. It features a 120 mm fan that reaches a maximum speed of 2000 RPM and delivers an airflow of up to 70.66 m³/h. The six copper heat pipes ensure effective heat transfer and contribute to the stability of system temperatures. With a maximum noise level of 31.5 dB, it guarantees quiet operation, making it an excellent choice for noise-sensitive environments. The ALUCIA H6LS M2 is compatible with various processor sockets, including LGA 1700 and LGA 1851, and supports a maximum power consumption of 150 watts. These features make it a reliable and efficient solution for cooling high-performance processors.

- Compatible with LGA 1700 and LGA 1851 processor sockets
- Maximum speed of 2000 RPM for high cooling performance
- Six copper heat pipes for effective heat dissipation
- Noise level of up to 31.5 dB for quiet operation
- Top-down cooler design for optimized airflow.

Actual product image Akasa ALUCIA H6LS M2 CPU cooler - 120 mm, black / blue (67.20 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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