Name: CPU Kühler Performance C A250 PWM.B
Brand: Xilence
SKU: 66309046
Price: 9.7 CHF
Availability: InStock
Rating: 4 (1 reviews)

productDetailPageQuery

Xilence

Quiet 92-mm PWM fan with hydraulic bearing

The Xilence A250PWM.B is a quiet and reliable cooling solution with a strong price-performance ratio. With its high airflow, it provides effective cooling for modern AMD processors and is ideal for daily use. The 92-mm PWM fan with hydraulic bearing operates particularly quietly and adjusts its speed flexibly. A lightweight aluminum heatsink supports efficient heat dissipation. Quick installation is facilitated by the practical Easy-Clip system. Compatible with AMD sockets AM4 and AM5, it includes thermal paste for immediate use.

Actual product image Xilence CPU Kühler Performance C A250 PWM.B (69 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

Search

Settings

Customer account

Comparison lists

Watch lists

Cart

Xilence CPU Kühler Performance C A250 PWM.B

Colour2

In Detail

Compare products

Goes with

Xilence CPU Kühler Performance C A250 PWM.B

Colour2

In Detail

Description

Specifications

Price trend

Warranty and return rates

Test reports1

Questions about this product1

Product ratings1

Compare products

Similar products

Sales rank in CPU coolers

Goes with

Accessories