Thermal Grizzly Minus Pad 8
0.50 mm, 8 W/m KDelivered between Tue, 15.7. and Wed, 16.7.
More than 10 pieces in stock at supplier
More than 10 pieces in stock at supplier
Free shipping starting at 50.–
Product details
For applications where thermal paste is not suitable due to difficult application or where distances need to be bridged between the heat source and the heatsink, the Thermal Grizzly Minus Pad 8 is the ideal choice - for example, on memory chips and voltage converters. It is based on a silicone-containing carrier complex and aluminum oxide as a heat transfer medium, making it similarly effective as thermal pastes.
Length | 20 mm |
Width | 120 mm |
Thickness | 0.50 mm |
Density | 3.30 g/cm³ |
Max. temperature | 200 °C |
Documents | |
Item number | 5070341 |
Manufacturer | Thermal Grizzly |
Category | Thermal pads |
Manufacturer no. | TG-MP8-120-20-05-1R |
Release date | 15.6.2015 |
External links |
Colour | Brown |
Material | Metal oxide, Silicone |
Thermal paste type | Heat conducting pad |
Thermal conductivity | 8 W/m K |
Max. temperature | 200 °C |
Density | 3.30 g/cm³ |
Items per sales unit | 1 x |
CO₂-Emission | |
Climate contribution |
Length | 20 mm |
Width | 120 mm |
Thickness | 0.50 mm |
Weight | 500 g |
Length | 18.50 cm |
Width | 14 cm |
Height | 0.10 cm |
Weight | 12 g |
Specifications may include unverified machine translations.
30-day right of return
24 Months Warranty (Bring-in)
2 additional offers