Name: NH-U12S CPU Cooler
Brand: Noctua
SKU: 47459886
Price: 109 CHF
Availability: InStock
Rating: 4.8 (186 reviews)

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Noctua

The Noctua NH-U12S is a high-quality CPU cooler designed for efficient processor cooling with minimal operating noise. This successor model of Noctua's classic U-series features a single-tower design with a 120 mm cooling fan, providing optimal thermal performance for various processor configurations. The cooler utilizes six heat pipes with direct contact technology to maximize heat transfer from the CPU to the aluminum fins. With dimensions of 158 mm in height, 125 mm in width, and 71 mm in depth, the NH-U12S offers excellent compatibility with most computer cases while allowing space for RAM modules. The included NF-F12 premium fan operates at speeds between 300 and 1500 RPM, generating an airflow of up to 93.4 m³/h with noise emissions of only 22.4 dB(A). The cooler supports a wide range of socket types, including Intel LGA 1700, 1200, 115x, and AMD AM5, AM4 platforms. Constructed with high-quality materials, the NH-U12S features a nickel-plated copper base and aluminum fins for durable, corrosion-resistant performance. The SecuFirm2 mounting system ensures easy installation with secure pressure across all supported sockets. The cooler maintains compatibility with high RAM modules up to 48 mm in height and can be set up for push-pull configurations with an optional second fan. It supports thermal design power for processors up to 180 W, making it suitable for high-performance computing applications. The NH-U12S includes NT-H1 thermal paste and comes with a 6-year manufacturer's warranty, reflecting the product's reliability and long-term performance consistency.

Actual product image Noctua NH-U12S CPU Cooler (158 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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