Name: CR-3000 CPU Cooler Dual Tower, ARGB - 2x 120 mm, black
Brand: Jonsbo
SKU: 39293498
Price: 45.5 CHF
Availability: InStock
Rating: 5 (3 reviews)

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Jonsbo

The Jonsbo CR-3000 CPU cooler is a highly advanced dual tower cooler designed for demanding applications. With a TDP of 260 W, it offers outstanding cooling performance, supported by its two cooling towers and seven nickel-plated 6mm heat pipes. The combination of a CNC-machined nickel-plated copper cooling block and optimal airflow ensures efficient heat dissipation, maximizing CPU performance. The two 120mm PWM fans are not only powerful but also quiet, contributing to a peaceful operation. Additionally, the cooler features ARGB lighting that adds visual accents and creates an infinity mirror effect. Its high RAM compatibility and universal mounting for AMD and Intel processors make the CR-3000 a flexible choice for various systems.

- Extremely powerful dual tower cooler with 260 W TDP
- Seven nickel-plated 6mm heat pipes for efficient heat dissipation
- Quiet 120mm PWM fans with optimized fan blades
- ARGB lighting with infinity mirror effect
- High RAM compatibility and universal mounting for AMD and Intel.

Actual product image Jonsbo CR-3000 CPU Cooler Dual Tower, ARGB - 2x 120 mm, black (160 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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