Name: Fortis 5 ARGB Black
Brand: Endorfy
SKU: 53701756
Price: 43.5 CHF
Availability: InStock
Rating: 4.9 (10 reviews)

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The Fortis 5 ARGB Black from Endorfy is a powerful CPU air cooler designed for a variety of processors. With its single-tower design and a height of 144 mm, it provides effective cooling for different socket types, including AM5, AM4, LGA 1200, and many more. The cooler is equipped with six heat pipes that ensure optimal heat dissipation, thus supporting the performance of the processor. The integrated ARGB lighting not only adds an appealing look but also allows for individual customization to match the system's design. The Fortis 5 ARGB Black is an ideal choice for those who value efficient cooling and attractive aesthetics.

- Compatible with a variety of sockets, including AM5, AM4, and LGA 2066
- Equipped with six heat pipes for improved heat dissipation
- Integrated ARGB lighting for customizable options
- Built-in 4-pin PWM connector for efficient fan control.

Actual product image Endorfy Fortis 5 ARGB Black (159 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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