Name: Assassin VC Elite WH
Brand: Deepcool
SKU: 60868246
Price: 130.95 CHF
Availability: InStock
Rating: 5 (3 reviews)

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Deepcool

The K Cooler Assassin VC Elite White from Deepcool is a powerful CPU cooler designed for demanding applications and gaming enthusiasts. With a maximum thermal design power (TDP) of 300 watts, this cooler delivers outstanding cooling performance, supported by innovative vapor chamber technology. This technology significantly enhances heat transfer, ensuring that heat is efficiently dissipated from the CPU. The cooler is equipped with two 140mm fans that can operate in both quiet and high-performance modes, allowing for flexible adaptation to varying requirements. The sleek and clear design of the Assassin VC Elite WH not only provides an appealing look but also optimizes airflow through the fin stack. Weighing 1772 grams and standing 164 mm tall, this cooler is robust yet compact enough to fit in most cases.

- Vapor chamber technology for improved heat transfer
- Maximum TDP of 300 watts for high cooling performance
- Switch between quiet and high-performance operating modes
- Optimized airflow through a sleek design
- High-quality 3-phase fan motors for quiet operation.

Actual product image Deepcool Assassin VC Elite WH (164 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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