Microscale Heat Conduction in Integrated Circuits and Their Constituent Films

The book "Microscale Heat Conduction in Integrated Circuits and Their Constituent Films" offers a comprehensive analysis of the challenges and advancements in heat conduction within integrated circuits. Given the ongoing miniaturization in semiconductor technology, the need to understand the thermal properties of transistors and their materials is becoming increasingly urgent. The authors, Y. Sungtaek Ju and Kenneth E. Goodson, develop high-resolution measurement techniques to determine temperature fields in transistors and interconnections. These techniques are based on thermoreflectance thermometry, which allows for the capture of temperature distributions with a spatial resolution of nearly 300 nm and a temporal resolution of about 10 ns. The book is aimed at professionals and students who wish to explore the thermal aspects of integrated circuits and their materials.