Semiconductor Advanced Packaging

English, John H. Lau, 2022
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Product details

The textbook "Semiconductor Advanced Packaging" by John H. Lau offers a comprehensive analysis of the design, material, process, and manufacturing aspects of advanced semiconductor packaging components and systems. It is aimed at professionals and students in the fields of electrical engineering, mechanical engineering, materials science, and engineering. The focus is on engineering practice, while fundamental principles are also addressed. The content includes a detailed examination of key topics such as system-in-package, various packaging technologies at wafer and panel levels, as well as innovative integration methods like 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration. Additionally, modern techniques such as chiplet packaging and various bonding methods are discussed, making the book a valuable resource for research and development in the semiconductor industry.

Key specifications

Language
English
topic
Technology & IT
Subtopic
Electrical engineering
Author
John H. Lau
Number of pages
520
Book cover
Paperback
Year
2022
Item number
52869969

General information

Publisher
Springer
Category
Reference books
Release date
10.11.2024

Book properties

topic
Technology & IT
Subtopic
Electrical engineering
Language
English
Author
John H. Lau
Year
2022
Number of pages
520
Book cover
Paperback
Year
2022

Voluntary climate contribution

CO₂-Emission
Climate contribution

Product dimensions

Height
230 mm
Width
150 mm

30-day right of return if unopened
24 Months Warranty (Bring-in)

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