Frei applizierbare MOSFET-Sensorfolie zur Dehnungsmessung

While the integration density of semiconductor chips has advanced rapidly and continues to do so, the degree of miniaturization in packaging and interconnection technology (AVT) is comparatively weak. One approach to increasing AVT packaging density is to use bendable chips. Key to reliable bendability is the ability to fabricate brittle thin chips with functional semiconductor devices. In particular, the combination of thin chips and flexible polymer substrates opens up the possibility of developing densely packed sensor films, i.e. sensor arrays that can be applied to three-dimensional surfaces. This work is understood as a contribution to the investigation of thin CMOS chips both in terms of fracture resistance and electrical behavior of MOSFETs. The knowledge gained in the process was used for the development.