Name: CNPS4X Black V2 92mm Fan
Brand: Zalman
SKU: 58630382
Price: 35.2 CHF
Availability: InStock

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The Zalman CNPS4X Black V2 92mm Fan is a powerful CPU cooler designed for effective cooling of processors. With a robust aluminum heatsink and innovative Direct Touch Heatpipe technology, this cooler ensures optimal heat dissipation. The integrated high-performance 92mm fan offers a variable fan speed ranging from 800 to 2000 RPM, allowing for customizable cooling performance. The three high-performance heatpipes contribute to the efficiency of the cooling system, ensuring that even under heavy use, the processor does not overheat. The installation of the cooler is user-friendly, making it a practical choice for various CPU platforms. The CNPS4X is compatible with a range of Intel and AMD CPUs and supports a TDP of up to 150 W, making it suitable for high-performance applications.

- Direct Touch Heatpipe technology for improved heat transfer
- High-performance 92mm fan with PWM control for customizable cooling performance
- Three heatpipes for efficient heat dissipation
- Compatible with Intel LGA1700, LGA1200, LGA115X and AMD AM5, AM4, AM3
- Hydro bearing for quiet operation and long lifespan.

Actual product image Zalman CNPS4X Black V2 92mm Fan (135 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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