Thermalright Helios AMD Thermal pad
0.20 mm, 8.50 W/m KDelivered between Wed, 11.6. and Thu, 19.6.
More than 10 items in stock at supplier
More than 10 items in stock at supplier
Product details
The Thermalright Helios AMD Thermal Pad is a high-performance thermal interface pad specifically designed for efficient heat transfer in AMD processors. With a thermal conductivity of 8.5 W/m·K, it ensures effective cooling and contributes to the stability and longevity of the hardware. The pad has a thickness of just 0.2 mm, making it ideal for applications where space is limited. It is available in a convenient size of 40 mm x 40 mm, allowing for easy handling and adaptation to various components. This thermal pad is an excellent choice for anyone looking to optimize the performance of their AMD processors.
- High thermal conductivity of 8.5 W/m·K for optimal cooling
- Thin design with only 0.2 mm thickness for space-saving applications
- Ideal for use with AMD processors to enhance heat dissipation.
Length | 40 mm |
Width | 40 mm |
Thickness | 0.20 mm |
Item number | 46982326 |
Manufacturer | Thermalright |
Category | Thermal pads |
Manufacturer no. | 814256016230 |
Release date | 2.7.2024 |
Thermal paste type | Heat conducting pad |
Thermal conductivity | 8.50 W/m K |
Items per sales unit | 1 x |
CO₂-Emission | |
Climate contribution |
Length | 40 mm |
Width | 40 mm |
Thickness | 0.20 mm |
Length | 10.50 cm |
Width | 10.30 cm |
Height | 1.10 cm |
Weight | 34 g |
Specifications may include unverified machine translations.
30-day right of return
24 Months Warranty (Bring-in)