Raise3D Pro3 Plus HS

Raise3D Pro3 Plus HS Built-in HyperFFF Technology: Featuring a new hot-end design that addresses previous bending issues and is now also compatible with the regular Pro3 series. HyperCore and industrial high-performance materials: Introduction of a new hot end with a SiC nozzle tailored for HyperCore filaments, which is also compatible with the Pro3 series. Increased extrusion temperature: The maximum extrusion temperature reaches 320 ºC to achieve better printing performance with more demanding materials. Extended printing operation time: With two print heads that seamlessly alternate, printing continues without interruption as the second hot end takes over when the material of the first runs out. Optimization of the drive system: The implementation of new closed-loop stepper motors enhances the precision of extruder movement, ensures stability, and eliminates step losses. New RFID sensor: In anticipation of future enhancements, we have integrated an RFID sensor to prepare for potential RFID labeling of the filament.