Name: SR630 V4 6505P 12C
Brand: Lenovo
SKU: 64346588
Price: 1972 CHF
Availability: InStock

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Lenovo

The Lenovo SR630 V4 processor is a powerful Intel Xeon 6505P with 12 cores, designed for demanding server applications. With a base clock frequency of 2.2 GHz and a maximum turbo clock frequency of 4.1 GHz, this processor delivers high computing power suitable for data-intensive tasks and virtualization environments. The SR630 V4 supports up to 4 TB of DDR5 SDRAM and enables efficient use of memory resources through its octa-channel memory architecture. With a thermal design power (TDP) of 150 watts, this processor is designed to provide an optimal balance between performance and energy efficiency. The processor architecture is 64-bit, allowing for improved processing of large data sets. The SR630 V4 is therefore an excellent choice for companies looking for a reliable and scalable solution for their server infrastructure.

- 12 processor cores and 24 threads for high multitasking performance
- Maximum internal memory support of 4 TB
- Octa-channel memory architecture for improved memory bandwidth
- 48 MB L3 cache for faster data access
- Scalability for up to 2 processors.

Actual product image Lenovo SR630 V4 6505P 12C (LGA 4710, 2.20 GHz, 12 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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