Name: DCG ThinkSystem SR590/SR650 Intel Xeon 6234 8C Processor Option Kit w/o FAN
Brand: Lenovo
SKU: 14053585
Price: 7265 CHF
Availability: OutOfStock

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The Intel Xeon Gold 6234 processor is a powerful option for server applications, designed to meet the demands of modern data centers and cloud computing environments. With a clock speed of 3.3 GHz and 8 cores supporting 16 threads, this processor delivers high processing power and efficiency. It is equipped with a 24.75 MB L3 cache that optimizes data processing speed. Support for DDR4 SDRAM and a hexagonal memory architecture allows for a maximum memory capacity of up to 1 TB, making it ideal for memory-intensive applications. Additionally, the Xeon Gold 6234 features advanced technologies such as AVX-512 and Hyper-Threading, significantly enhancing performance for parallel processing tasks. This processor is designed for use in Lenovo ThinkSystem SR590 and SR650 servers, providing a reliable solution for demanding workloads.

- Supports up to 1 TB of DDR4 RAM for high memory capacity
- Optimized for multi-cloud computing and network workloads
- Offers 16 threads for improved multitasking capabilities
- Integrated AVX-512 technology for enhanced performance in compute-intensive tasks
- Maximum turbo clock speed of 4 GHz for additional performance when needed.

Actual product image Lenovo DCG ThinkSystem SR590/SR650 Intel Xeon 6234 8C Processor Option Kit w/o FAN (Socket P, 3.30 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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