Name: LC-CC-85 80mm fan
Brand: LC-Power
SKU: 12504765
Price: 9.55 CHF
Availability: InStock
Rating: 2 (1 reviews)

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LC-Power

The LC-Power LC-CC-85 is an efficient CPU cooler designed for a variety of socket types, including LGA775, LGA1156, AM2, AM2+, AM3, LGA1155, AM3+, FM1, FM2, and LGA1150. With a compact design and a fan diameter of 80 mm, this cooler provides reliable cooling performance for various computer applications. The cooler is made from lightweight aluminum, making it not only sturdy but also easy to install. The hydraulic bearing mechanism ensures quiet operation and a long fan lifespan. With a rotational speed of up to 2200 RPM and an airflow of 12 to 32 CFM, the LC-CC-85 is capable of efficiently dissipating heat and regulating the processor's temperature. This makes it an ideal choice for users who need reliable cooling for their systems.

- Compatible with a variety of socket types, including Intel and AMD
- Lightweight aluminum casing for improved heat dissipation
- Hydraulic bearings for quiet operation and long lifespan
- Rotational speed of 800 to 2200 RPM for customizable cooling performance
- Easy installation thanks to compact design.

Actual product image LC-Power LC-CC-85 80mm fan (45 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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