Name: Xeon W-2223 3.6 GHz
Brand: Intel
SKU: 21439920
Price: 116.65 CHF
Availability: InStock

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Intel

Intel Xeon W-2223 - 3.6 GHz processor with 4 cores and 8 threads. It features 8.25 MB of cache memory and is compatible with LGA2066 socket. 

Product details:
- Model: Xeon W-2223
- Processor type: Intel Xeon W-2223
- Number of cores: Quad-Core / 8 threads
- Cache memory: 8.25 MB
- Applicable sockets: LGA2066
- Clock frequency: 3.6 GHz
- Max turbo clock speed: 3.9 GHz
- Manufacturing process: 14 nm

Features include:
- Enhanced SpeedStep technology
- Hyper-Threading technology
- Demand based switching
- Support for execute disable bit
- Intel virtualization technology
- Intel 64 technology
- Intel trusted execution technology
- Streaming SIMD extensions 4.2
- Intel Turbo Boost technology 2.0
- Intel advanced vector extensions (AVX)
- Intel AES new instructions (AES-NI)
- Thermal monitoring technologies
- Intel virtualization technology for directed I/O (VT-d)
- Intel vPro technology
- Idle states.

Actual product image Intel Xeon W-2223 3.6 GHz (LGA 2066, 3.60 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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