Name: Xeon Silver 4416+ - 2 GHz - 20 Ker
Brand: Intel
SKU: 32788968
Price: 1049 CHF
Availability: InStock

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Intel

The Intel Xeon Silver 4416+ is a powerful processor designed for demanding computing tasks in server and workstation environments. With a base clock frequency of 2 GHz and the ability to reach up to 3.9 GHz in Turbo Boost mode, this processor delivers high performance for multithreading applications. It features 20 cores and supports up to 40 threads, enabling efficient processing of multiple tasks simultaneously. The Xeon Silver 4416+ is equipped with state-of-the-art virtualization technology that ensures improved management and security in virtualized environments. Additionally, it supports DDR5 RAM and offers a maximum memory capacity of 4000 GB, making it an ideal choice for memory-intensive applications. The combination of a high core count, advanced virtualization, and extensive memory capacity makes this processor an excellent choice for businesses that rely on performance and reliability.

- Intel® Trusted Execution Technology for enhanced security
- Intel® Directed I/O Virtualization Technology (VT-d) for improved I/O device virtualization
- Intel® Virtualization Technology (VT-x) for utilizing multiple virtual platforms
- Maximum TDP of 165 watts for efficient power consumption
- Support for octa-channel memory architecture with DDR5 RAM.

Actual product image Intel Xeon Silver 4416+ - 2 GHz - 20 Ker (LGA 4677, 2 GHz, 20 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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