Name: Xeon Silver 4410Y FC-LGA16A Cache Boxed CPU
Brand: Intel
SKU: 32648430
Price: 644.75 CHF
Availability: InStock

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Intel

The Intel Xeon Silver 4410Y is a powerful processor designed for use in data centers and demanding data processing tasks. With a base clock frequency of 2 GHz and the ability to reach up to 3.9 GHz in Turbo mode, this processor offers solid performance for various applications. It features 12 processor cores and supports up to 24 threads, enabling efficient multitasking. The integrated architecture is designed for energy efficiency, with a maximum thermal design power (TDP) of 150 watts, making it a suitable choice for environments where energy consumption and heat generation are critical. The Xeon Silver 4410Y supports memory speeds of up to 4000 MHz and provides improved data processing speed with a 30 MB L3 cache. These features make it an ideal solution for businesses seeking reliable and powerful hardware.

- 12 processor cores and 24 threads for efficient multitasking performance
- Maximum Turbo clock frequency of 3.9 GHz for increased performance when needed
- 10-nanometer lithography for improved energy efficiency
- Support for PCI Express version 5 for fast data transfer
- Includes Intel Boxed for added protection and cooling.

Actual product image Intel Xeon Silver 4410Y FC-LGA16A Cache Boxed CPU (LGA 4677, 2 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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