Name: Xeon Silver 4214
Brand: Intel
SKU: 21017198
Price: 777 CHF
Availability: InStock
Rating: 5 (1 reviews)

productDetailPageQuery

Intel

Product Description

Powerful Processor: S3647 Xeon Silver 4214 Tray

The S3647 Xeon Silver 4214 Tray is a powerful processor featuring a 12-core design with a clock speed of 2.2 GHz. It delivers impressive performance for demanding tasks.

High Energy Efficiency

With a power consumption of only 85 W, this processor is characterized by high energy efficiency. This results in lower operating costs and reduced environmental impact.

Support for Large Workloads

The S3647 Xeon Silver 4214 Tray is capable of handling large workloads and provides reliable performance for demanding applications and data processing tasks.

Support for Virtualization

This processor offers support for virtualization technologies, enabling businesses to utilize their IT resources more efficiently and reduce overall operating costs.

Advanced Security Features

The S3647 Xeon Silver 4214 Tray comes with advanced security features that help protect sensitive data and applications from threats and ensure compliance with data protection regulations.

Actual product image Intel Xeon Silver 4214 (LGA 3647, 2.20 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

Search

Settings

Customer account

Comparison lists

Watch lists

Cart

Intel Xeon Silver 4214

In Detail

Compare products

Goes with

Intel Xeon Silver 4214

Similar products with faster delivery

In Detail

Description

Specifications

Price trend

Warranty and return rates

Questions about this product0

Product ratings1

Compare products

Sales rank in Processors

Goes with

Accessories