Name: Xeon Eight Core E5-2640V3,2.6GHz,22nm
Brand: Intel
SKU: 6054498
Price: 273 CHF
Availability: InStock

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The Intel Xeon E5-2640 v3 is a powerful processor designed for demanding server and workstation applications. With a base clock frequency of 2.6 GHz and the ability to reach up to 3.4 GHz in Turbo mode, this processor delivers excellent performance for multithreading applications. The architecture is based on an advanced 22nm manufacturing process, which allows for efficient energy use and reduced heat generation. With a total of 8 cores and 16 threads, the Xeon E5-2640 v3 can handle multiple tasks simultaneously, making it ideal for virtualization, database management, and other compute-intensive tasks. The high TDP of 90 W ensures that the processor remains stable under load, while the generous cache sizes of 20 MB for L1, L2, and L3 enable fast data processing. This processor is an excellent choice for businesses seeking reliability and performance.

- Maximum Turbo clock frequency of 3.4 GHz for additional performance when needed
- Supports up to 16 threads for improved multitasking capabilities
- Efficient 22nm manufacturing process for lower power consumption
- High cache sizes (20 MB for L1, L2, and L3) for fast data access
- Compatible with the LGA 2011-v3 socket for easy integration into existing systems.

Actual product image Intel Xeon Eight Core E5-2640V3,2.6GHz,22nm (LGA 2011-v3, 2.60 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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