Name: Xeon 5118 processor L3
Brand: Intel
SKU: 20491864
Price: 1601 CHF
Availability: InStock

isSSR

offer

olderThan3MonthTimestamp

path

sectorId

shopArea

slug

tagIds

productDetailPageQuery

productBySlug

alternateLinks

dutchAuctionBannerLazy

alternateLinksByPath

currentAuctionEvent

Zurich

Lausanne

Basel

Kriens

Winterthur

Bern

Dietikon

Geneva

Wohlen

St. Gallen

Intel

Intel® AES New Instructions (Intel® AES-NI) is a set of instructions for fast and secure encryption and decryption of data. AES-NI are valuable components for cryptographic applications, such as mass encryption/decryption, authentication, random number generation, and authentication encryption.

The enhanced Intel SpeedStep® technology is an advanced feature designed for mobile devices that require a combination of high performance with minimal energy consumption. The traditional Intel SpeedStep® technology adjusts voltage and frequency simultaneously between high and low values based on processor load. The enhanced Intel SpeedStep® technology builds on this architecture and employs design strategies such as separating voltage and frequency changes, as well as clock partitioning and recovery.

With Intel® Virtualization Technology.

Actual product image Intel Xeon 5118 processor L3 (Socket P, 2.30 GHz, 12 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Search

Intel Xeon 5118 processor L3

Product details

Compare products

Goes with

Reviews & Ratings

Intel Xeon 5118 processor L3

Similar products with faster delivery

Product details

Description

Specifications

Price trend

Compare products

Sales rank in Processors

Goes with

Accessories

Reviews & Ratings

Warranty & return rates

Questions about this product

Product ratings