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Intel

The Intel Core i7-13700 processor is a powerful component designed for demanding applications and multitasking scenarios. With a base clock frequency of 2.1 GHz and a maximum turbo clock frequency of up to 5.2 GHz, this processor delivers impressive performance for modern computer applications. The architecture is based on Raptor Lake technology and supports a variety of features necessary for data processing and program execution. The processor has 16 cores that operate in 24 threads, enabling efficient processing of parallel tasks. Additionally, the i7-13700 supports up to 128 GB of RAM and is equipped with integrated UHD Graphics 770, which meets basic graphical requirements. With a 30 MB L3 cache and a 24 MB L2 cache, this processor ensures fast data access and improved overall performance.

- Maximum turbo clock frequency of 5.2 GHz for high performance under load
- 16 cores and 24 threads for efficient multitasking
- Supports up to 128 GB DDR4 RAM for extensive applications
- Integrated UHD Graphics 770 for basic graphical tasks
- LGA 1700 socket for compatibility with modern motherboards.

Actual product image Intel CORE I7-13700 2.10GHZ (LGA 1700, 2.10 GHz, 16 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

CORE I7-13700 2.10GHZ

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