Name: Core i7-12700K, 3.6 GHz, 25 MB, BOX (BX8071512700K)
Brand: Intel
SKU: 21188617
Price: 259 CHF
Availability: InStock

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Intel

The Intel Core i7-12700K processor is a powerful component designed for desktop computers. With a base clock speed of 3.6 GHz and the ability to reach up to 5.0 GHz in Turbo mode, this processor delivers impressive performance for demanding applications and games. It belongs to the Alder Lake family and features 12 cores, enabling efficient multitasking. The processor is equipped with an LGA 1700 socket and has a generous 25 MB cache, further optimizing data processing. The integrated UHD Graphics 770 GPU provides enhanced graphics performance without the need for a separate graphics card. With a maximum Thermal Design Power (TDP) of 125 watts, the i7-12700K is both powerful and energy-efficient, making it an ideal choice for modern computing applications.

- 12 processor cores for efficient multitasking performance
- Maximum Turbo clock speed of 5.0 GHz for high performance
- Integrated UHD Graphics 770 for improved graphics processing
- 25 MB L3 cache for faster data access
- Compatible with LGA 1700 socket for modern motherboards.

Actual product image Intel Core i7-12700K, 3.6 GHz, 25 MB, BOX (BX8071512700K) (LGA 1700, 3.60 GHz, 12 -Core)

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Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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Core i7-12700K, 3.6 GHz, 25 MB, BOX (BX8071512700K)

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