Name: Core i5 12400
Brand: Intel
SKU: 31177600
Price: 135.96 CHF
Availability: InStock
Rating: 3 (4 reviews)

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Intel

Short info: Intel Core i5 12400 - 2.5 GHz - 6 cores - 12 threads - 18 MB cache memory - OEM Group Processor Upgrades Manufacturer Intel Product Type. No. CM8071504650608 Model Core i5 12400 EAN/UPC 8592978355135 Product Description: Intel Core i5 12400 / 2.5 GHz Processor Product Type Processor Processor Type Intel Core i5 12400 (12th Gen.) No. of Cores 6 Cores / 12 Threads Cache Memory 18 MB Integrated Graphics Intel UHD Graphics 730 Processor Instance. 1 Clock speed 2.5 GHz Max. Turbo clock speed 4.4 GHz Manufacturing process 10 nm Features Enhanced SpeedStep technology, Hyper-Threading Technology, Support for Execute Disable Bit, Intel Virtualization Technology, Intel 64 Technology, Streaming SIMD Extensions 4.1, Streaming SIMD Enhancements 4.2, Intel Turbo Boost Technology 2.0, Intel AES New Instructions (AES-NI), Thermal Monitoring Technologies, Intel Virtualization Technology for Directed I/O (VT-d), Idle States, Intel VT-x with Extended Page Tables (EPT), Intel Secure Key,.

Actual product image Intel Core i5 12400 (LGA 1700, 2.50 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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