Name: Core i3 i3-14100F - 3.5 GHz - 4 Ke
Brand: Intel
SKU: 42922586
Price: 89 CHF
Availability: InStock
Rating: 5 (3 reviews)

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Intel

The Intel Core i3 i3-14100F processor is a powerful and efficient solution for desktop computers. With a base clock speed of 3.5 GHz and the ability to handle up to 4 cores and 8 threads, this processor delivers solid performance for everyday applications and multitasking. The i3-14100F belongs to the 14th generation of Intel Core processors and utilizes the Raptor Lake architecture, known for its energy efficiency and high performance. The processor supports both DDR4 and DDR5 memory, allowing for a maximum RAM capacity of 192 GB, making it a flexible choice for various usage scenarios. With a 12 MB L3 cache and a 5 MB L2 cache, the i3-14100F ensures fast data access and improved system responsiveness. The processor is designed for the LGA 1700 socket and supports the latest PCI Express versions, making it future-proof.

- Maximum turbo clock speed of 4.7 GHz for additional performance when needed
- Dual-channel memory architecture for improved data transfer rates
- Support for PCI Express 5.0 for faster connections to graphics cards and other expansion cards
- Maximum thermal design power (TDP) of 58 watts for energy-efficient operation
- Optimized for desktop environments, ideal for PC, client, and tablet applications.

Actual product image Intel Core i3 i3-14100F - 3.5 GHz - 4 Ke (LGA 1700, 3.50 GHz, 4 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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