Name: 285
Brand: Intel
SKU: 54181543
Price: 636.25 CHF
Availability: InStock

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Intel

The Intel Core Ultra 9 285 processor is a powerful solution for desktop computers, designed for demanding applications in workstations, PCs, clients, and tablets. With an impressive number of 24 cores and 24 threads, this processor offers high multitasking capability and enables efficient processing of complex tasks. The integrated neural processing unit (NPU) with Intel AI Boost supports a variety of AI software frameworks, making it ideal for modern applications in the field of artificial intelligence. The processor supports up to 192 GB of DDR5 SDRAM and offers a maximum boost frequency of 5.6 GHz, ensuring outstanding performance for compute-intensive tasks. Additionally, the integrated graphics solution allows for flexible connectivity to various output devices.

- Maximum overall performance of up to 36 TOPs for AI applications
- Support for up to 192 GB of DDR5 SDRAM for high memory capacity
- Integrated neural processing unit (NPU) for enhanced AI performance
- Supports up to 4 displays via onboard graphics adapters
- PCI Express slots of versions 4.0 and 5.0 for expanded connectivity.

Actual product image Intel 285 (LGA 1851, 2.50 GHz, 24 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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