Name: FROZN A620 PRO SE ARGB - CPU Luftkler - Max 25 dBA
Brand: ID-Cooling
SKU: 60395339
Price: 37.5 CHF
Availability: InStock

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ID-Cooling

The FROZN A620 PRO SE ARGB from ID-Cooling is a powerful CPU air cooler designed for efficient heat dissipation in modern computer systems. With a maximum noise level of just 25 dBA, this cooler offers nearly silent cooling, making it ideal for gaming and work environments. The cooler is equipped with a 120 mm fan that allows for a variable rotation speed of 300 to 2000 RPM, enabling airflow adjustment as needed. The hydraulic bearings ensure a long lifespan and reliable performance. Furthermore, the FROZN A620 PRO SE supports a variety of processor sockets, making it a flexible choice for different builds. The integrated ARGB lighting allows for personalized customization of the appearance, ensuring that the cooler is not only functional but also aesthetically pleasing.

- Maximum noise level of just 25 dBA for quiet operation
- Variable fan speed from 300 to 2000 RPM for adjustable airflow
- Hydraulic bearings for improved durability and performance
- Supports a variety of processor sockets, including LGA 1700 and AM5
- Integrated ARGB lighting for customizable options.

Actual product image ID-Cooling FROZN A620 PRO SE ARGB - CPU Luftkler - Max 25 dBA (157 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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