productDetailPageQuery

Iceberg Thermal

Key Features Performances Suitable for Processor Type Cooler Fan diameter 12 cm Supported processor slots LGA 1150 (Socket H3), LGA 1151 (Socket H4), LGA 1155 (Socket H2), LGA 1156 (Socket H), LGA 1200 (Socket H5), LGA 1366 (Socket B), LGA 2011 (Socket R), LGA 2011-v3 (Socket R), LGA 2066, LGA 775 (Socket T), Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket AM4, Socket FM1, Socket FM2, Socket FM2+ Rotation Speed (min.) 500 rpm Rotation speed (max.) 1850 rpm Noise level (high speed) 36 dB Maximum airflow 76 cfm Maximum air pressure 2.8 mmH2O Pulse width modulation support Yes Bearing type Fluid Dynamic Bearing (FDB) Quantity per package 1 unit(s) Mean time between failures (MTBF) 150000 h Design Product color Turquoise Radiator material Aluminum No. of fans 1 Fan No. of heat pipes 6 Illumination LED Yes Colors of illumination Multi Fan connector 4-pin Power Voltage 5 - 12 V Rated current 0.2 A Amperage.

Actual product image Iceberg Thermal IceSLEET X6 - RGB - AM4/Intel (159 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Search

Settings

Customer account

Comparison lists

Watch lists

Cart

Iceberg Thermal IceSLEET X6 - RGB - AM4/Intel

In Detail

Compare products

Goes with

Iceberg Thermal IceSLEET X6 - RGB - AM4/Intel

Similar products with faster delivery

In Detail

Description

Specifications

Price trend

Warranty and return rates

Test reports2

Questions about this product0

Product ratings0

Compare products

Sales rank in CPU coolers

Goes with

Accessories