Name: Intel Xeon E5-2620 v4 2.1GHz
Brand: HPE
SKU: 18074025
Price: 939 CHF
Availability: InStock

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The Intel Xeon E5-2620 v4 is a powerful processor designed for demanding server and workstation applications. With a base clock frequency of 2.1 GHz and the ability to reach up to 3 GHz in Turbo mode, this processor delivers excellent performance for multithreading applications. It features 8 cores and supports 16 threads, allowing for efficient processing of multiple tasks simultaneously. The processor architecture is based on advanced 14-nanometer lithography, ensuring high energy efficiency and performance. The Xeon E5-2620 v4 is compatible with an LGA 2011-v3 socket and supports DDR4 RAM with a maximum capacity of 1540 GB, making it an ideal choice for modern server environments. Additionally, it offers a high transfer rate of 8 GT/s and a generous L3 cache of 20 MB, further optimizing data processing.

- Maximum Turbo clock frequency of 3 GHz for additional performance
- Supports up to 1540 GB of DDR4 RAM for extensive memory requirements
- 8 cores and 16 threads for efficient multitasking
- Maximum TDP of 85 watts for energy-efficient performance
- Quad-channel memory architecture for improved bandwidth.

Actual product image HPE Intel Xeon E5-2620 v4 2.1GHz (LGA 2011-v3, 2.10 GHz, 8 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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