Name: DL380 Xeon Silver 4210R 2.4 GHz
Brand: HPE
SKU: 13349984
Price: 639 CHF
Availability: InStock

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10-core server CPU, socket LGA 3647. LGA 3647 Intel Xeon Silver 4210R, including standard heatsink for DL380. 10 cores, clock speed from 2.4 GHz to 3.2 GHz. Supports up to 1 TB DDR4 memory. Scalable to up to 2-socket configurations. Optimized for balanced energy efficiency and performance. Thermal Design Power (TDP): 100 W. The Intel Xeon Scalable processors are the ideal foundation for secure and agile multi-cloud data centers. They deliver workload-optimized performance and hardware-accelerated security. Compute-intensive tasks such as real-time data analytics, virtualized infrastructures, and high-performance computing are their specialties. More cores, PCIe lanes, and DDR4 channels. The Xeon Scalable platform provides 48 PCIe 3.0 lanes per CPU for NVMe SSDs and GPU/FPGA accelerators. Six DDR4 memory channels offer even more memory than before. Additionally, the enhanced AVX-512 instruction set increases throughput for demanding tasks. This accelerates modeling and simulations, data analytics and machine learning, data compression, visualizations, and digital content creation. Xeon Platinum nomenclature. The new Xeon CPUs come with a new naming convention. As the names suggest, Bronze is intended for entry-level systems, up to Platinum systems for up to 8 sockets and with up to 28 cores. Within the different groups, the server processors can be distinguished by their unique four-digit suffix and the T or M suffix.

Actual product image HPE DL380 Xeon Silver 4210R 2.4 GHz (LGA 3647, 2.40 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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HPE DL380 Xeon Silver 4210R 2.4 GHz

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