Name: CPU BDW E5-2640 V4 10C
Brand: HPE
SKU: 18073696
Price: 1789 CHF
Availability: InStock

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The CPU BDW E5-2640 V4 from Hewlett Packard Enterprise is a powerful processor designed for demanding applications and server environments. With 10 processor cores and a base clock frequency of 2.4 GHz, this processor delivers excellent performance for multithreading applications. The architecture of the processor is based on 64-bit technology and utilizes advanced 14-nanometer lithography, enabling efficient energy use. The E5-2640 V4 supports DDR4 RAM and offers a maximum memory capacity of up to 1540 GB, making it ideal for memory-intensive tasks. Additionally, the quad-channel memory architecture allows for high bandwidth and improved data transfer rates, while the 25 MB L3 cache further optimizes processing speed. With a maximum turbo clock frequency of 3.4 GHz, the processor can provide additional power when needed, making it a flexible solution for various computing demands.

- 10 processor cores and 20 threads for efficient multitasking
- Maximum turbo clock frequency of 3.4 GHz for additional performance
- Supports up to 1540 GB DDR4 RAM for memory-intensive applications
- Quad-channel memory architecture for high bandwidth
- 14-nanometer lithography for improved energy efficiency.

Actual product image HPE CPU BDW E5-2640 V4 10C (LGA 2011-v3, 2.40 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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