Name: AMD EPYC 9754 CPU FOR HPE-STOCK
Brand: HPE
SKU: 38709529
Price: 23483 CHF
Availability: OutOfStock

productDetailPageQuery

The AMD EPYC 9754 processor from Hewlett Packard Enterprise is a powerful CPU specifically designed for demanding, memory-intensive applications. With an impressive 128 cores and 256 threads, this processor delivers outstanding multithreading performance, which is crucial for modern data centers and high-performance computing. The EPYC 9754 supports the latest DDR5 memory standard with a maximum clock speed of 4800 MHz, significantly enhancing data processing speed. The processor is housed in the SP5 socket and features a base clock frequency of 2.25 GHz, which can be boosted up to 3.1 GHz when needed. With a maximum Thermal Design Power (TDP) of 360 watts, the EPYC 9754 is designed for use in high-performance server environments, ensuring efficient heat dissipation and power management.

- 128 processor cores and 256 threads for high multithreading performance
- Supports DDR5 SDRAM with clock speeds up to 4800 MHz
- Maximum turbo clock frequency of 3.1 GHz for additional performance
- Dodeca-channel memory architecture for improved memory bandwidth
- 256 MB L3 cache for faster data access.

Actual product image HPE AMD EPYC 9754 CPU FOR HPE-STOCK (SP5, 2.25 GHz)

Key specifications

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

Search

Settings

Customer account

Comparison lists

Watch lists

Cart

HPE AMD EPYC 9754 CPU FOR HPE-STOCK

In Detail

Compare products

Goes with

HPE AMD EPYC 9754 CPU FOR HPE-STOCK

Similar products with faster delivery

In Detail

Description

Specifications

Price trend

Warranty & return rates

Questions about this product0

Product ratings0

Compare products

Sales rank in Processors

Goes with

Accessories