Name: AMD EPYC 9475F 3.5-3.7GHz 48-core 400W Processor
Brand: HPE
SKU: 52234351
Price: 14428 CHF
Availability: OutOfStock

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The AMD EPYC 9475F processor from Hewlett Packard Enterprise is a powerful solution specifically designed for memory-intensive high-performance computing (HPEC) workloads. With an impressive number of 48 cores and 96 threads, this processor delivers outstanding multithreading performance optimized for demanding applications and data processing. The clock frequency ranges from 3.5 to 3.7 GHz, with the ability to reach up to 4.8 GHz in Turbo mode. This allows for flexible adaptation to various workloads and requirements. The processor supports DDR5 RAM and features a hexa-channel memory architecture that ensures high bandwidth and efficiency. With a maximum thermal design power (TDP) of 400 watts, the EPYC 9475F is both powerful and energy-efficient, making it an ideal choice for modern data centers and enterprise applications.

- Maximum turbo clock frequency of 4.8 GHz for additional performance when needed
- Support for DDR5 RAM to enhance memory bandwidth
- Hexa-channel memory architecture for optimized data processing
- 256 MB L3 cache to accelerate data access times
- PCI Express version 5 for high data transfer rates and expansion capabilities.

Actual product image HPE AMD EPYC 9475F 3.5-3.7GHz 48-core 400W Processor (SP5, 3.65 GHz, 48 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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