Name: AMD EPYC 7543P 32-core Processor for
Brand: HPE
SKU: 30854408
Price: 2868.4 CHF
Availability: InStock

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The AMD EPYC 7543P processor from Hewlett Packard Enterprise is a powerful solution for server applications that require high processing performance. With 32 cores and a base clock frequency of 2.8 GHz, this processor delivers impressive multithreading performance optimized for demanding workloads. The architecture is based on advanced 7nm technology, ensuring efficient energy use and high performance. The processor supports DDR4 SDRAM with a maximum memory clock rate of 3200 MHz and enables octa-channel memory connectivity, further enhancing data processing speed. With a maximum Thermal Design Power (TDP) of 225 watts, the EPYC 7543P is suitable for both energy-efficient and high-performance server solutions. These features make it an ideal choice for businesses seeking a robust and scalable server architecture.

- Maximum turbo clock frequency of 3.7 GHz for additional performance when needed
- 64 threads for improved multitasking capabilities
- 256 MB L3 cache to optimize data processing
- Support for 7nm lithography for higher efficiency
- Compatible with the SP3 processor socket for easy integration into existing systems.

Actual product image HPE AMD EPYC 7543P 32-core Processor for (SP3, 2.80 GHz, 32 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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