Name: Intel Core i5-6600 processor Smart Cache
Brand: HP
SKU: 16500634
Price: 679 CHF
Availability: InStock

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The Intel Core i5-6600 processor is a powerful and efficient 6th generation processor suitable for a variety of applications. With a base clock speed of 3.3 GHz and a maximum turbo frequency of 3.9 GHz, this processor delivers excellent performance for everyday tasks as well as more demanding applications. The i5-6600 features four processor cores and supports up to four threads, enabling smooth multitasking performance. The integrated HD Graphics 530 enhances graphic rendering, while the 6 MB Smart Cache accelerates data processing. With a maximum Thermal Design Power (TDP) of 65 watts, the processor is energy-efficient and well-suited for compact systems. The LGA 1151 socket allows for easy integration into compatible motherboards, and support for up to 64 GB of RAM provides ample memory for demanding applications.

- Maximum turbo frequency of 3.9 GHz for additional performance
- Integrated HD Graphics 530 for improved graphic rendering
- Supports up to 64 GB of RAM for extensive applications
- Dual-channel memory channels for higher bandwidth
- 14 nm lithography for improved energy efficiency.

Actual product image HP Intel Core i5-6600 processor Smart Cache (LGA 1151, 3.30 GHz, 4 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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