Name: A10 CPU Cooler 1U for Socket G34 passive
Brand: Dynatron
SKU: 25120310
Price: 31.9 CHF
Availability: InStock

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Dynatron

The Dynatron A10 CPU cooler is a passive cooler specifically designed for the G34 socket. With its robust construction and the use of high-quality copper in the cooler core, it provides efficient heat dissipation for high-performance processors. This cooler is ideal for applications where silent cooling is required, as it operates without active fans. The A10 cooler is designed for use in 1U cases and supports fan sizes of up to 140 mm, allowing for flexible integration into various systems. The passive cooling ensures that the system operates quietly and energy-efficiently while keeping the processor temperature within the optimal range. The Dynatron A10 is a reliable choice for servers and workstations that need effective cooling without additional noise.

- Passive cooler for silent operation
- High-quality copper core for efficient heat dissipation
- Compatible with G34 socket
- Suitable for 1U cases and supports 140 mm fans.

Actual product image Dynatron A10 CPU Cooler 1U for Socket G34 passive (44.45 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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