Delock thermal pad 70 x 20 x 0.75 mm for M.2 modules 3.2 WmK - Low Oil Bleeding

This thermal pad from Delock is suitable for heat dissipation, for example on an M.2 module. The goal of the pad is to improve performance and extend the lifespan of the components.

Low oil bleeding: This pad releases very little oil, which protects electronic components and contacts from contamination and can provide a longer lifespan. Pads with "Low Oil Bleeding" maintain their thermal and mechanical properties better, ensuring consistent and stable heat dissipation.

Technical specifications:

• Thermal pad for heat dissipation
• Low oil bleeding
• Thermal conductivity: 3.2 W/mK
• Operating temperature: -60 °C to 180 °C
• Color: gray
• Dimensions (LxWxH): approx. 70 x 20 x 0.75 mm

Package contents:

• 1 x thermal pad

Packaging:

• Resealable bag.