Name: Ryzen ThreadRipper PRO 5955WX - 4 GH
Brand: AMD
SKU: 23263816
Price: 702.2 CHF
Availability: InStock

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The AMD Ryzen ThreadRipper PRO 5955WX is a powerful processor specifically designed for demanding applications in the high-end desktop (HEDT) segment. With 16 cores and 32 threads, it delivers outstanding performance for both single-threaded and multi-threaded applications. The processor operates at a base clock speed of 4 GHz and can reach up to 4.5 GHz in turbo mode, making it ideal for compute-intensive tasks such as gaming and content creation. Thanks to the advanced 7-nanometer FinFET manufacturing process, the ThreadRipper PRO 5955WX offers high energy efficiency and improved heat dissipation. The large cache memory of 64 MB L3 and 8 MB L2 ensures fast data access and optimizes overall performance. The processor is designed for the sWRX8 platform and supports up to 2 TB of DDR4 RAM in octa-channel operation, making it an excellent choice for professional applications.

- 16 Zen 3 cores with 280 watts Thermal Design Power (TDP)
- Supports Simultaneous Multithreading (SMT) for 32 threads
- Highly efficient 7-nanometer FinFET transistors
- AVX2 instruction set extension for complex vector calculations
- 128 PCIe 4.0 lanes for extensive expansion options.

Actual product image AMD Ryzen ThreadRipper PRO 5955WX - 4 GH (sWRX8, 4 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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