Name: Ryzen 7 Pro 7745 - 3.8 GHz - 8-core - 16 threads - 32 MB cache - Socket AM5 - Processors mul
Brand: AMD
SKU: 37099925
Price: 310 CHF
Availability: InStock
Rating: 5 (1 reviews)

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The AMD Ryzen 7 PRO 7745 is a powerful processor designed for desktop applications. With a base frequency of 3.8 GHz and the ability to reach up to 5.3 GHz in Turbo mode, this processor delivers impressive performance for demanding tasks. It features 8 cores and 16 threads, enabling efficient multitasking performance. The processor utilizes an advanced 5nm lithography, ensuring high energy efficiency and improved performance. The Ryzen 7 PRO 7745 supports DDR5 SDRAM with high memory speeds of up to 5200 MHz, further enhancing data processing speed. Additionally, it is equipped with integrated AMD Radeon Graphics, providing solid graphics performance for everyday applications. The processor is compatible with the AM5 socket and is suitable for various operating systems, including Windows 11 and popular Linux distributions.

- 8 cores and 16 threads for efficient multitasking
- Maximum Turbo clock speed of 5.3 GHz
- Supports DDR5 SDRAM with memory speeds up to 5200 MHz
- Integrated AMD Radeon Graphics for basic graphics processing
- Dual-channel memory architecture for improved data bandwidth.

Actual product image AMD Ryzen 7 Pro 7745 - 3.8 GHz - 8-core - 16 threads - 32 MB cache - Socket AM5 - Processors mul (AM5, 3.80 GHz, 8 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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