Name: RYZEN 5 PRO 8500G 5.0GHZ 6 CORE
Brand: AMD
SKU: 45657246
Price: 223 CHF
Availability: InStock

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The AMD Ryzen 5 PRO 8500G is a powerful processor designed for desktop applications. With an advanced 4nm lithography and a base frequency of 3.5 GHz that can be boosted up to 5.0 GHz in Turbo mode, this processor delivers impressive performance for demanding tasks. It features 6 cores and 12 threads, enabling efficient multitasking capabilities. Support for up to 256 GB of DDR5 RAM and a dual-channel memory architecture ensure a high data processing rate. Additionally, the processor is equipped with an integrated AMD Radeon 740M graphics unit, providing solid graphics performance for everyday applications and multimedia. The Ryzen 5 PRO 8500G is compatible with various operating systems, including Windows 10/11 and various Linux distributions, making it a flexible choice for different user needs.

- Processor architecture: 64-bit with support for modern instruction sets like AVX-512 and SSE4.2
- Maximum TDP of 65 watts, ensuring energy-efficient performance
- Integrated graphics with support for DisplayPort and HDMI 2.1
- Maximum L3 cache of 16 MB for improved data access times
- Support for up to 4 connected monitors, ideal for multi-monitor setups.

Actual product image AMD RYZEN 5 PRO 8500G 5.0GHZ 6 CORE (AM5, 3.50 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

NPU power

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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