Name: Ryzen 5 7500F
Brand: AMD
SKU: 39444682
Price: 149 CHF
Availability: InStock
Rating: 4.8 (35 reviews)

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The AMD Ryzen 5 7500F is a powerful processor designed for desktop applications. With an advanced 5-nanometer lithography and a Thermal Design Power (TDP) of 65 watts, this processor offers an excellent balance between performance and energy efficiency. It features 6 cores and supports 12 threads thanks to Simultaneous Multithreading (SMT) technology, making it ideal for multitasking and demanding applications. The base clock speed of 3.7 GHz can be boosted up to 5.0 GHz in Turbo mode, ensuring high performance for gaming and creative applications. The Ryzen 5 7500F is compatible with the AM5 processor socket and supports modern DDR5 SDRAM memory with high clock rates, further enhancing the overall system performance. Additionally, the PCI-Express 5.0 interface allows for extremely fast data transfers, which is advantageous for future expansions.

- 6 cores with 12 threads for improved multitasking capabilities
- Maximum Turbo clock frequency of 5.0 GHz for high performance
- Support for DDR5 SDRAM with memory clock rates up to 5200 MHz
- Integrated AVX-512 instruction set extension for complex calculations
- Unlocked multiplier for manual overclocking and performance tuning.

Actual product image AMD Ryzen 5 7500F (AM5, 3.70 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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