Name: EPYC 9454 - 2.75 GHz - 48 cores - 96
Brand: AMD
SKU: 32374444
Price: 1769.03 CHF
Availability: InStock

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The AMD EPYC 9454 processor is a powerful solution for server applications designed for high efficiency and multithreading. With a base clock frequency of 2.75 GHz and the ability to reach up to 3.8 GHz in turbo mode, this processor delivers impressive performance for demanding tasks. It features 48 cores and supports up to 96 threads, making it ideal for virtualization, data analysis, and other compute-intensive applications. The EPYC 9454 is equipped with a generous 256 MB L3 cache, further optimizing data processing speed. The processor is designed for the SP5 socket and supports the latest DDR5 memory with a maximum clock rate of 4800 MHz, enhancing system bandwidth and efficiency. With a maximum thermal design power (TDP) of 290 watts, the EPYC 9454 is both powerful and energy-efficient, making it an excellent choice for modern server architectures.

- 48 cores and 96 threads for optimal multithreading performance
- Supports DDR5 SDRAM up to 4800 MHz
- 256 MB L3 cache for improved data processing
- Maximum TDP of 290 watts for efficient energy consumption
- Compatible with the SP5 socket for modern server solutions.

Actual product image AMD EPYC 9454 - 2.75 GHz - 48 cores - 96 (SP5, 2.75 GHz, 48 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Number of threads

PCI express version (max.)

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Germany

JACOB

EPYC 9454 - 2.75 GHz - 48 cores - 96

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