Name: EPYC 7713P 2 GHz
Brand: AMD
SKU: 21973615
Price: 1706.43 CHF
Availability: InStock

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Short info: AMD EPYC 7713P - 2 GHz - 64 cores - 128 threads - 256 MB cache memory - Socket SP3 - OEM Group Processor Upgrades 

Manufacturer: AMD  
Product Art. No.: 100-0000337  
Model: EPYC 7713P  
EAN/UPC: 8592978329747  

Product Description: AMD EPYC 7713P / 2 GHz Processor  
Product Type: Processor  
Processor Type: AMD EPYC 7713P (3rd Gen.)  
No. of cores: 64 cores / 128 threads  
Cache memory: 256 MB  
Applicable Socket: Socket SP3  
Processor Instance: 1  
Clock frequency: 2 GHz  
Max. Turbo clock speed: 3.675 GHz  
Features: AMD Architecture, AMD Guard, AMD Workload Affinity  

Detailed specifications:  
General  
Product Type: Processor  
Processor Type / Form Factor: AMD EPYC 7713P (3rd Gen.)  
No. of Cores: 64 Cores  
No. of Threads: 128 Threads  
Cache Memory: 256 MB  
Cache Memory Details: L3 - 256 MB  
Processor Instance: 1  
Clock speed: 2 GHz  
Max. Turbo clock speed: 3.675 GHz  
Suitable sockets: Socket SP3  
Thermal Design Power (TDP): 280 W  
PCI Express Revision: 4.0  
No. of lanes: PCI Express Lanes 128  
Architecture Features: AMD Architecture, AMD Guard, AMD Workload.

Actual product image AMD EPYC 7713P 2 GHz (SP3, 2 GHz, 64 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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