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The AMD EPYC 32-Core Model 7543 SP3 BOX processor is a powerful solution specifically designed for server-based applications. With an architecture aimed at maximizing efficiency and performance, this processor offers an impressive combination of computing power, memory bandwidth, and security features. The 32 cores and 64 threads enable excellent multitasking capabilities, while support for DDR4 SDRAM and a maximum memory bandwidth of 204.8 GB/s ensure that even memory-intensive applications run smoothly. The EPYC 7543 is ideal for businesses seeking a reliable and scalable solution for their critical applications.

- Maximum clock speed of 3.7 GHz in Turbo mode
- Supports octa-channel memory architecture for enhanced performance
- High TDP of 240 watts for demanding applications
- 256 MB L3 cache for quick data access
- Package includes a storage box without a cooler.

Actual product image AMD EPYC 32Core Model 7543 SP3 BOX (SP3, 2.80 GHz)

Key specifications

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

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