Name: AMD Ryzen™ 5 5500F 6-core processor
Brand: AMD
SKU: 75107569
Price: 106.5 CHF
Availability: InStock

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The AMD Ryzen 5 5500F 6-Core Processor is a powerful CPU designed for desktop applications. With a base clock speed of 3.6 GHz and a boost clock speed of up to 4.4 GHz, this processor delivers impressive performance for multitasking and demanding applications. It features 6 cores and 12 threads, allowing for efficient processing of multiple tasks simultaneously. The processor utilizes TSMC's advanced 7nm FinFET technology, ensuring high energy efficiency with a maximum power consumption of only 65 watts. With a generous 19 MB cache and support for DDR4 memory up to 3200 MHz, the Ryzen 5 5500F is ideal for gaming and creative applications. The boxed version comes with a Wraith Stealth cooler, providing effective cooling and quiet operation.

- 6 cores and 12 threads for efficient multitasking
- Boost clock speed up to 4.4 GHz for high performance
- 19 MB cache for fast data processing
- Includes Wraith Stealth cooler for optimal cooling.

Actual product image AMD AMD Ryzen™ 5 5500F 6-core processor (AM4, 3 GHz, 6 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Number of threads

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

L3 Cache

Another issue is the fundamental tradeoff between cache latency and hit rate. Larger caches have better hit rates but longer latency. To address this tradeoff, many computers use multiple levels of cache, with small fast caches backed up by larger slower caches.

Multi-level caches generally operate by checking the smallest Level 1 (L1) cache first; if it hits, the processor proceeds at high speed. If the smaller cache misses, the next larger cache (L2) is checked, and so on, before external memory is checked.

As the latency difference between main memory and the fastest cache has become larger, some processors have begun to utilize as many as three levels of on-chip cache.

PCI express version (max.)

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AMD Ryzen™ 5 5500F 6-core processor

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AMD Technologies

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Scope of delivery

Package dimensions

The processor features 6 cores and 12 threads for parallel data processing in various applications.

Six cores with hyper-threading

The AM4 socket allows the model to be installed in compatible motherboards featuring this interface.

AM4 processor socket

With a TDP of 65 W, the processor has a comparatively low cooling requirement.

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AMD AMD Ryzen™ 5 5500F 6-core processor

At a Glance

Six cores with hyper-threading

AM4 processor socket

Low power consumption

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AMD AMD Ryzen™ 5 5500F 6-core processor

At a Glance

Six cores with hyper-threading

AM4 processor socket

Low power consumption

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AM4 processor socket