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The A6-3500 APU is a powerful triple-core processor suitable for a variety of applications. With a base clock speed of 2.1 GHz and a maximum turbo clock speed of 2.4 GHz, this processor delivers solid performance for everyday tasks as well as multimedia applications. The architecture is based on the Llano platform and supports 64-bit operating systems, enabling efficient data processing. The A6-3500 features an integrated Radeon HD 6530D graphics unit, which provides enhanced graphics performance for gaming and graphics-intensive applications. With a maximum thermal design power (TDP) of 65 watts, this processor is energy-efficient and well-suited for compact systems. Support for AMD Virtualization and additional technologies such as NX-Bit and Clear Video HD makes it a versatile choice for various user needs.

- Triple-core architecture for improved multitasking capabilities
- Integrated Radeon HD 6530D graphics unit for enhanced graphics performance
- Support for AMD Virtualization for efficient virtualization solutions
- Maximum turbo clock speed of 2.4 GHz for extra performance when needed
- Energy-efficient 65-watt TDP for compact and quiet systems.

Actual product image AMD A6-3500 Apu, 3c/3t (FM1, 2.10 GHz, 3 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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