Name: Chunk 4 Max CPU Cooler - 2x 120mm
Brand: Alpenföhn
SKU: 24457681
Price: 75.9 CHF
Availability: InStock
Rating: 4.3 (4 reviews)

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Alpenföhn

High-performance 250W TDP Dual-Tower for demanding systems

The matte black surface coating, 6x6mm heat pipes, large asymmetrical heatsink, and aerodynamically optimized fin design – the Brocken 4 Max combines pure performance with near-silent operation, even in demanding systems.

JetStream fans

Our brand new JetStream fans set new standards in our Alpenföhn portfolio! Each fan features an airflow-optimized impeller, a modified frame, and modern bearings that ensure excellent smoothness at maximum performance. The anti-vibration pads of the JetStream minimize vibrations to a minimum.

High-end heat pipes & copper base plate

The 6 high-end heat pipes are connected over a large area to the nickel-plated copper base plate, ensuring that the CPU's heat is effectively absorbed. This allows the heat pipes to quickly and efficiently transport the processor's heat to the large heatsink.

Matte black surface coating

The entire heatsink of the Brocken 4 is coated in elegant matte black. Black is beautiful – don't you agree?

Asymmetrical heatsink

The asymmetrical design of the Brocken 4 Max offers you maximized flexibility when choosing RAM modules. No matter how tall the module's heat spreader is – it fits effortlessly! 100% RAM compatibility on sockets 1700, 1200, 115X, AM5, and AM4.

Compatibility

The included Rock Mount 3 mounting system provides a secure connection to the sockets: Intel LGA: 1700, 1200, 115X, 20XX AMD: AM5, AM4.

Expandable fan mounting

For even more performance, additional fan clips and decoupling elements are included. This allows you to easily attach an additional 120mm fan on the other side of the heatsink and further enhance cooling performance.

Actual product image Alpenföhn Chunk 4 Max CPU Cooler - 2x 120mm (158 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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