Name: AK-CC6601EP01 Low Profile CPU Cooler - Socket LGA 1700
Brand: Akasa
SKU: 20378846
Price: 25.9 CHF
Availability: InStock

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Akasa

The features of the Akasa AK-CC6601EP01 Low Profile CPU Cooler at a glance:

- Low-profile cooler for Intel CPUs with LGA1700 socket
- Very flat cooler, ideal for SFF systems
- PWM control in the speed range of 600 to 3,000 RPM
- For CPUs up to 35 W TDP

Very flat CPU cooler for your SFF system

The Akasa AK-CC6601EP01 is a very flat CPU cooler for Intel Alder Lake processors (LGA1700). With a height of just 26.9 mm, it fits even in the smallest Micro-ATX and Mini-ITX setups or HTPC systems. The cooler, featuring an aluminum heatsink, also looks stylish, making it a great choice for cases where the interior is visible.

At the heart of the Akasa AK-CC6601EP01 is a fan with a diameter of 75 mm. This fan is controlled via PWM signal in a range between 600 and 3,000 RPM.

The CPU cooler is compatible with Intel's LGA1700 socket and connects to the motherboard via a 4-pin PWM connector. Its use of standard connectors ensures high compatibility with other products. Mounting materials and thermal paste are included in the package. Installation is straightforward and tool-free using push pins.

Technical details:

- Dimensions: 87.2 x 26.92 x 85.2 mm (W x H x D)
- Material: Aluminum (heatsink, fins), plastic
- Fan: 75 x 10 mm (W x H)
  Noise level: max. 30.75 dB(A)
  Static pressure: max. 1.81 mmH2O
  Airflow: max. 39.84 m³/h
  Speed: 600 - 3,000 RPM
  Voltage: 12 V
  Current: 0.19 A
  Lifespan: 40,000 h
- Connection: 4-pin PWM
- Compatibility: Intel socket: 1700.

Actual product image Akasa AK-CC6601EP01 Low Profile CPU Cooler - Socket LGA 1700 (26.92 mm)

Key specifications

Socket

A CPU socket or CPU slot is a mechanical component that provides mechanical and electrical connections between a microprocessor and a printed circuit board (PCB). This allows the CPU to be replaced without soldering.
Common sockets have retention clips that apply a constant force, which must be overcome when a device is inserted. For chips with a large number of pins, either zero-insertion force (ZIF) sockets or land grid array (LGA) sockets are used instead. These designs apply a compression force once either a handle (for ZIF type) or a surface plate (LGA type) is put into place. This provides superior mechanical retention while avoiding the risk of bending pins when inserting the chip into the socket.

Diameter

Number of fans

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Airflow

The air volume refers to the amount of air that can be moved or circulated per unit of time. It is often measured in cubic metres per hour or litres per second. A higher air volume generally indicates a stronger suction force or circulation of air.

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